Free Classifieds at AUNetAds.com - View Item Content by ID 2362917

AUNetAds > Computers > Hardware > Item ID 2362917

Item ID 2362917 in Category: Computers - Hardware

Cannot view this item. It could be pending, expired or deleted.
Below item is randomly selected from the same category and may have similar content.

Flip Chip CSP Substrate: Efficiency, Reliability, and Application


A flip chip essentially implies that the chip is flipped over to make an association with the substrate or lead outline. Flip chip doesn't rely upon the wire holding for of interconnection however it utilizes bind or knocks like copper point of support. This implies that the I/O cushions can be put at any segment of the outer layer of the chip and consequently the chip size can be decreased with a proper hardware way.

Contact info:- https://efpcb.wordpress.com/2024/09/25/flip-chip-csp-substrate-efficiency-reliability-and-application/

Related Link: Click here to visit item owner's website (0 hit)

Target State: All States
Target City : Shenzhen
Last Update : 03 February 2025 8:55 PM
Number of Views: 46
Item  Owner  : Shawn Wang
Contact Email:
Contact Phone: +86-755-23724206

Friendly reminder: Click here to read some tips.
AUNetAds > Computers > Hardware > Item ID 2362917
 © 2025 AUNetAds.com
2025-02-16 (0.479 sec)