IC Substrate PCB (Computers - Hardware)

Item ID 2339268 in Category: Computers - Hardware

IC Substrate PCB
Microfluidic Cooling: In some applications, microfluidic cooling systems are employed to circulate a liquid coolant through microchannels in the substrate. This method provides effective heat removal while minimizing the impact on the overall form factor. Thermal Vias: Placing thermal vias in the IC Substrate PCB design allows heat to be transferred from the IC to other layers of the board, enhancing heat dissipation. Strategic placement of vias is essential for optimizing thermal conductivity. Contact Info:- High Quality PCB Co., Limited Office: Shajing Town, Baoan District, Shenzhen, Guangdong 518000, China Plant 1 address: Building 5-6, Fu Qiao 3rd Industrial Zone, Bao' an, Shenzhen, Guangdong, China Plant 2 address: Zhuhai, Guangdong, China Plant 3 address: Dongguan, Guangdong, China TEL: +86-755-23724206 WahtsApp: +86-189 2381 2997 Skype: shawnwang2006 Email: sales@efpcb.com
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Target State: All States Target City : Shenzhen Last Update : 02 January 2024 8:09 PM Number of Views: 87	Item Owner : Shawn Wang Contact Email: Contact Phone: +86-755-23724206

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2024-05-05 (0.223 sec)