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Item ID 2283237 in Category: Computers - Hardware

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Package Substrates are the Backbone of Semiconductor Packaging


Package substrates, also known as interposers or printed circuit boards (PCBs), are the foundation upon which semiconductor devices are built. They are typically made of materials like fiberglass-reinforced epoxy (FR-4), ceramics, or more advanced materials like silicon or laminate substrates with copper traces. These substrates offer a platform for mounting and interconnecting the various IC components, such as the die, wire bonds, and external pins or balls.

Contact info:- https://efpcb.weebly.com/blog/package-substrates-are-the-backbone-of-semiconductor-packaging

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Target State: All States
Target City : Shenzhen
Last Update : 01 October 2024 1:32 AM
Number of Views: 100
Item  Owner  : Shawn Wang
Contact Email:
Contact Phone: +86-755-23724206

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2024-11-01 (0.334 sec)