Package Substrates are the Backbone of Semiconductor Packaging | |
Package substrates, also known as interposers or printed circuit boards (PCBs), are the foundation upon which semiconductor devices are built. They are typically made of materials like fiberglass-reinforced epoxy (FR-4), ceramics, or more advanced materials like silicon or laminate substrates with copper traces. These substrates offer a platform for mounting and interconnecting the various IC components, such as the die, wire bonds, and external pins or balls. Contact info:- https://efpcb.weebly.com/blog/package-substrates-are-the-backbone-of-semiconductor-packaging | |
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Target State: All States Target City : Shenzhen Last Update : 01 October 2024 1:32 AM Number of Views: 55 | Item Owner : Shawn Wang Contact Email: Contact Phone: +86-755-23724206 |
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