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Item ID 2268709 in Category: Computers - Hardware

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BOC package substrate


The electronics world today is changing with the improvement in the size of semiconductor technology. One of the most important facets that have made this innovation possible is the Ball-on-Chip (BOC) package substrate. BOC substrates though hidden have the great responsibility of providing an enabling environment for the latest gadgets right from smartphones to high-performance computers to perform optimally. In this blog, let me explain what BOC package substrate are, the need, and the role of these substrates in contemporary electronics.

Contact Info:-

High Quality PCB Co., Limited

Office: Shajing Town, Baoan District, Shenzhen, Guangdong 518000, China

Plant 1 address: Building 5-6, Fu Qiao 3rd Industrial Zone, Bao' an, Shenzhen, Guangdong, China

Plant 2 address: Zhuhai, Guangdong, China

Plant 3 address: Dongguan, Guangdong, China

TEL: +86-755-23724206

WahtsApp: +86-189 2381 2997

Skype: shawnwang2006

Email: sales@efpcb.com


Target State: All States
Target City : Shenzhen
Last Update : 30 September 2024 9:22 PM
Number of Views: 61
Item  Owner  : Shawn Wang
Contact Email:
Contact Phone: +86-755-23724206

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2024-10-16 (0.334 sec)