BOC package substrate | |
The electronics world today is changing with the improvement in the size of semiconductor technology. One of the most important facets that have made this innovation possible is the Ball-on-Chip (BOC) package substrate. BOC substrates though hidden have the great responsibility of providing an enabling environment for the latest gadgets right from smartphones to high-performance computers to perform optimally. In this blog, let me explain what BOC package substrate are, the need, and the role of these substrates in contemporary electronics. Contact Info:- High Quality PCB Co., Limited Office: Shajing Town, Baoan District, Shenzhen, Guangdong 518000, China Plant 1 address: Building 5-6, Fu Qiao 3rd Industrial Zone, Bao' an, Shenzhen, Guangdong, China Plant 2 address: Zhuhai, Guangdong, China Plant 3 address: Dongguan, Guangdong, China TEL: +86-755-23724206 WahtsApp: +86-189 2381 2997 Skype: shawnwang2006 Email: sales@efpcb.com | |
Target State: All States Target City : Shenzhen Last Update : 30 September 2024 9:22 PM Number of Views: 61 | Item Owner : Shawn Wang Contact Email: Contact Phone: +86-755-23724206 |
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