Issues Related to PCB Manufacturing Issues (Computers - Hardware)

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Item ID 1820300 in Category: Computers - Hardware

Issues Related to PCB Manufacturing Issues

These are plated through-holes and are the conductive connection between the inner layers of a PCB. Defects occur due to lack of control in the manufacturing steps while fabricating through-holes. After the board undergoes thermal processes (reflow, wave soldering, or rework), an open circuit failure caused by inner-layer separation can cause intermittent electrical open or complete open. Across each and every pad solderability may become uneven; this clearly indicates reduction in solderability, especially for tiny parts such as BGA and Flip Chip.

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Last Update : 08 January 2022 5:44 PM
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Item  Owner  : Shawn Wang
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Contact Phone: +86-755-23724206

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2022-11-29 (0.232 sec)